SDF Diamond Technology

The next generation in Diamond layering providing ultimate performance in both cutting speed and life. Diamond particles are positioned symmetrically throughout the length, width and height of the segments. They are also set in rows of alternating height to permit a constant level of Diamond at the cutting face, by allowing natural release of worn out Diamond particles at the same time as exposure of new Diamond.

The benefits include:
•Increased cutting speed
•Improved cutting life
•Smoother cutting
•Less drag on the machine
•More competitive pricing